| Thermal challenges in next-generation electronic systems SV Garimella, AS Fleischer, JY Murthy, A Keshavarzi, R Prasher, C Patel, ... IEEE Transactions on Components and Packaging Technologies 31 (4), 801-815, 2008 | 560 | 2008 |
| Investigation into the application of low melting temperature alloys as wet thermal interface materials CK Roy, S Bhavnani, MC Hamilton, RW Johnson, JL Nguyen, RW Knight, ... International Journal of Heat and Mass Transfer 85, 996-1002, 2015 | 115 | 2015 |
| Effect of surface geometry and orientation on laminar natural convection heat transfer from a vertical flat plate with transverse roughness elements SH Bhavnani, AE Bergles International Journal of Heat and Mass Transfer 33 (5), 965-981, 1990 | 112 | 1990 |
| Teamwork across disciplinary borders: A bridge between college and the work place SH Bhavnani, MD Aldridge Journal of Engineering Education 89 (1), 13-16, 2000 | 104 | 2000 |
| Effect of nucleation site spacing on the pool boiling characteristics of a structured surface ND Nimkar, SH Bhavnani, RC Jaeger International journal of heat and mass transfer 49 (17-18), 2829-2839, 2006 | 102 | 2006 |
| Boiling augmentation with micro/nanostructured surfaces: current status and research outlook S Bhavnani, V Narayanan, W Qu, M Jensen, S Kandlikar, J Kim, J Thome Nanoscale and Microscale Thermophysical Engineering 18 (3), 197-222, 2014 | 98 | 2014 |
| Simulation of EPS foam decomposition in the lost foam casting process XJ Liu, SH Bhavnani, RA Overfelt Journal of Materials Processing Technology 182 (1-3), 333-342, 2007 | 90 | 2007 |
| A multiscale model of thermal contact resistance between rough surfaces RL Jackson, SH Bhavnani, TP Ferguson | 82 | 2008 |
| Experimental study of torrefied pine as a gasification fuel using a bubbling fluidized bed gasifier A Kulkarni, R Baker, N Abdoulmomine, S Adhikari, S Bhavnani Renewable Energy 93, 460-468, 2016 | 60 | 2016 |
| Natural convection heat transfer from sinusoidal wavy surfaces SH Bhavnani, AE Bergles Wärme-und Stoffübertragung 26 (6), 341-349, 1991 | 58 | 1991 |
| Estimation of biomass synthesis gas composition using equilibrium modeling G Gautam, S Adhikari, S Bhavnani Energy & Fuels 24 (4), 2692-2698, 2010 | 55 | 2010 |
| Thermal performance of low melting temperature alloys at the interface between dissimilar materials CK Roy, S Bhavnani, MC Hamilton, RW Johnson, RW Knight, DK Harris Applied Thermal Engineering 99, 72-79, 2016 | 54 | 2016 |
| A closed-form multiscale thermal contact resistance model RL Jackson, H Ghaednia, YA Elkady, SH Bhavnani, RW Knight IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (7 …, 2012 | 49 | 2012 |
| Re-entrant cavity surface enhancements for immersion cooling of silicon multichip packages NK Phadke, SH Bhavnani, A Goyal, RC Jaeger, JS Goodling IEEE transactions on components, hybrids, and manufacturing technology 15 (5 …, 2002 | 47 | 2002 |
| Experimental investigation of a direct liquid immersion cooled prototype for high performance electronic systems JL Gess, SH Bhavnani, RW Johnson IEEE Transactions on Components, Packaging and Manufacturing Technology 5 …, 2015 | 41 | 2015 |
| Tar analysis in syngas derived from pelletized biomass in a commercial stratified downdraft gasifier G Gautam, S Adhikari, S Thangalazhy-Gopakumar, C Brodbeck, ... BioResources 6 (4), 4653-4661, 2011 | 38 | 2011 |
| Accelerated aging and thermal cycling of low melting temperature alloys as wet thermal interface materials CK Roy, S Bhavnani, MC Hamilton, RW Johnson, RW Knight, DK Harris Microelectronics Reliability 55 (12), 2698-2704, 2015 | 36 | 2015 |
| An integral heat sink for cooling microelectronic components SH Bhavnani, CP Tsai, RC Jaeger, DL Eison | 36 | 1993 |
| Effect of channel width on pool boiling from a microconfigured heat sink RM Nowell, SH Bhavnani, RC Jaeger IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 2002 | 35 | 2002 |
| Immersion-cooled heat sinks for electronics: insight from high-speed photography SH Bhavnani, G Fournelle, RC Jaeger IEEE Transactions on Components and Packaging Technologies 24 (2), 166-176, 2001 | 34 | 2001 |
